Feed Integration and Packaging of a Millimeter Wave Antenna Array

A novel approach is presented and demonstrated for integrating a wideband vertically fed antenna array at Millimeter-Wave (mm-Wave) frequencies. Specifically, cost-effective Antenna-In-Package (AiP) fabrication presented, then prototype operating from 55 GHz to 64 built while predicted performance verified via measurements. The relies on separating into 1) the 2) back-end feeding board. Assembly of various components achieved through several precision microfabrication steps utilizing Ball-Grid-Array (BGA) technology with thermally stable conductive solder paste. paper describes realization final AiP aperture in terms design tolerances, laboratory equipment, component placement alignment, curing time duration temperature ranges, on-the-go testing.